Compact 3D wafer packaging using waveguide holographic optical elements

Conference proceeding

C. Nguyen, F. Lin and M. Wang

Vol.1773, pp.284-289

1993

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Title: Compact 3D wafer packaging using waveguide holographic optical elements
Creators: C. Nguyen - Physical Optics Corporation
F. Lin
M. Wang - Physical Optics Corporation
Publication Details: Vol.1773, pp.284-289
Comment: Export Date: 3 January 2023
Academic Unit: CoE - Electrical & Computer Engineering; College of Engineering
Resource Type: Conference proceeding
Record Identifier: 991031760394802976