Abstract
This paper describes a single-step method for assembling and encapsulating a microbubble chamber in which injection-molded plastic secures the fluidic and electrical interconnects. All of the necessary components for the chamber are loose assembled in a plastic-injection mold and subsequently packaged, encapsulated, and sealed in one molding step. These components include a silicon/Pyrex((R)) bubble chamber, copper electrical leads, and small-gauge stainless steel fluidic headers. This approach delivers a fully integrated microbubble chamber with 1) zero dead volume, 2) low electrical contact resistance (< 1 Ohm), 3) low compliance, in-plane fluid interconnects and 4) small overall dimensions (7.5 mm x 4 mm x 3 mm) conforming to the Dual In-Line Package (DIP) standard, Fig 1.
