Experimental and Numerical Characterization of Non-Fickian Moisture Diffusion in Electronic Packages

Journal article

Emrah Celik, Ibrahim Guven and Erdogan Madenci

IEEE transactions on advanced packaging, Vol.32(3), pp.666-674

2009

Abstract

Applied sciences

Design. Technologies. Operation analysis. Testing

Electronics

Exact sciences and technology

Integrated circuits

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

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Citation topics: 7 Engineering & Materials Science; 7.272 Electrical - Solder & Connections; 7.272.538 Solder Joints
Web Of Science research areas: Engineering, Electrical & Electronic; Engineering, Manufacturing; Materials Science, Multidisciplinary
ESI research areas: Engineering

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Title: Experimental and Numerical Characterization of Non-Fickian Moisture Diffusion in Electronic Packages
Creators: Emrah Celik - Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, United States
Ibrahim Guven - Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, United States
Erdogan Madenci - Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, United States
Publication Details: IEEE transactions on advanced packaging, Vol.32(3), pp.666-674
Publisher: Institute of Electrical and Electronics Engineers
Academic Unit: College of Engineering; CoE - Mechanical & Aerospace Engineering
Language: English
Resource Type: Journal article
Record Identifier: 991031613648902976