Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates

Journal article

Peer reviewed

Aparna Aravelli, Singiresu S Rao and Hari K Adluru

Journal of microelectronics and electronic packaging, Vol.10(1), pp.40-47

2013

Abstract

Applied sciences

Design. Technologies. Operation analysis. Testing

Electronics

Exact sciences and technology

Integrated circuits

Materials

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

2 Record Views

Title: Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates
Creators: Aparna Aravelli - University of Miami, Department of Mechanical and Aerospace Engineering, Coral Gables, Florida, 33146, United States
Singiresu S Rao - University of Miami, Department of Mechanical and Aerospace Engineering, Coral Gables, Florida, 33146, United States
Hari K Adluru - Florida International University, Department of Mechanical and Materials Engineering, Miami, Florida, 33199, United States
Publication Details: Journal of microelectronics and electronic packaging, Vol.10(1), pp.40-47
Publisher: International Microelectronics and Packaging Society
Academic Unit: College of Engineering; CoE - Mechanical & Aerospace Engineering
Language: English
Resource Type: Journal article
Record Identifier: 991031620144702976