Nanoscale Transport Enables Active Self-Assembly of Millimeter-Scale Wires

Journal article

Peer reviewed

Ofer IDAN, Amy LAM, Jovan KAMCEV, John GONZALES, Ashutosh AGARWAL and Henry HESS

Nano letters, Vol.12(1), pp.240-245

2012

PMID: 22111572

Abstract

Self-assembly

Exact sciences and technology

Condensed matter: structure, mechanical and thermal properties

Methods of nanofabrication

Materials science

Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties

Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)

Physics

Cross-disciplinary physics: materials science; rheology

14 Record Views

These are selected metrics from InCites Benchmarking & Analytics tool, related to this output

Citation topics: 1 Clinical & Life Sciences; 1.96 Cell Biology; 1.96.311 Microtubules
Web Of Science research areas: Chemistry, Multidisciplinary; Chemistry, Physical; Materials Science, Multidisciplinary; Nanoscience & Nanotechnology; Physics, Applied; Physics, Condensed Matter
ESI research areas: Materials Science

This output has contributed to the advancement of the following goals:

Source: InCites

Title: Nanoscale Transport Enables Active Self-Assembly of Millimeter-Scale Wires
Creators: Ofer IDAN - Department of Biomedical Engineering, Columbia University, New York, New York, United States
Amy LAM - Department of Biomedical Engineering, Columbia University, New York, New York, United States
Jovan KAMCEV - Department of Biomedical Engineering, Columbia University, New York, New York, United States
John GONZALES - Department of Biomedical Engineering, Columbia University, New York, New York, United States
Ashutosh AGARWAL - Department of Biomedical Engineering, Columbia University, New York, New York, United States
Henry HESS - Department of Biomedical Engineering, Columbia University, New York, New York, United States
Publication Details: Nano letters, Vol.12(1), pp.240-245
Publisher: American Chemical Society; Washington, DC
Academic Unit: College of Engineering; CoE - Biomedical Engineering
Language: English
Resource Type: Journal article
PMID: 22111572
Record Identifier: 991031560579802976