Tin Whisker Electrical Short Circuit Characteristics-Part II

Journal article

Karim J COUREY, Shihab S ASFOUR, Arzu ONAR, Jon A BAYLISS, Lawrence L LUDWIG and Maria C WRIGHT

IEEE transactions on electronics packaging manufacturing, Vol.32(1), pp.41-48

2009

Abstract

Electronics

Applied sciences

Exact sciences and technology

Microelectronic fabrication (materials and surfaces technology)

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

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Collaboration types: Domestic collaboration
Citation topics: 7 Engineering & Materials Science; 7.272 Electrical - Solder & Connections; 7.272.538 Solder Joints
Web Of Science research areas: Engineering, Manufacturing
ESI research areas: Engineering

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Source: InCites

Title: Tin Whisker Electrical Short Circuit Characteristics-Part II
Creators: Karim J COUREY - Orbiter Sustaining Engineering Office, National Aeronautics and Space Administration, Kennedy Space Center, FL 32899, United States
Shihab S ASFOUR - College of Engineering, University of Miami, Coral Gables, FL 33146, United States
Arzu ONAR - Biostatistics Department, St. Jude Children's Research Hospital, Memphis, TN 38105, United States
Jon A BAYLISS - Materials Science Division, National Aeronautics and Space Administration, Kennedy Space Center, FL 32899, United States
Lawrence L LUDWIG - Materials Science Division, National Aeronautics and Space Administration, Kennedy Space Center, FL 32899, United States
Maria C WRIGHT - Materials Science Division, National Aeronautics and Space Administration, Kennedy Space Center, FL 32899, United States
Publication Details: IEEE transactions on electronics packaging manufacturing, Vol.32(1), pp.41-48
Publisher: Institute of Electrical and Electronics Engineers; New York, NY
Language: English
Resource Type: Journal article
Record Identifier: 991031563060702976